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	<item>
		<title>Call for papers: Ground Effect Aerodynamics</title>
		<description> </description>
		<link>http://baytechdesign.com/call-for-papers-ground-effect-aerodynamics.htm</link>
			</item>
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		<title>Special issue: Micro/nanoelectronics and NEMS and MEMS packaging</title>
		<description> </description>
		<link>http://baytechdesign.com/special-issue-micronanoelectronics-and-nems-and-mems-packaging.htm</link>
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		<title>Special issue: The role of enabling technologies in optimising supply chain activities (Part 2)</title>
		<description> </description>
		<link>http://baytechdesign.com/special-issue-the-role-of-enabling-technologies-in-optimising-supply-chain-activities-part-2.htm</link>
			</item>
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		<title>Special issue: Applications of software engineering and artificial intelligence to developing and integrating web applications</title>
		<description> </description>
		<link>http://baytechdesign.com/special-issue-applications-of-software-engineering-and-artificial-intelligence-to-developing-and-integrating-web-applications.htm</link>
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		<title>Special issue: Systems and architectures for embedded processing: applications and hardware</title>
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		<link>http://baytechdesign.com/special-issue-systems-and-architectures-for-embedded-processing-applications-and-hardware.htm</link>
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		<title>Special issue: Competitiveness and foreign direct investment in new member countries of the EU</title>
		<description> </description>
		<link>http://baytechdesign.com/special-issue-competitiveness-and-foreign-direct-investment-in-new-member-countries-of-the-eu.htm</link>
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		<title>Special issue: Competitiveness and foreign direct investment in new member countries of the EU</title>
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		<title>Special issue: Tangible and embedded interaction</title>
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		<link>http://baytechdesign.com/special-issue-tangible-and-embedded-interaction-2.htm</link>
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		<title>Special issue: Tangible and embedded interaction</title>
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		<title>Special issue: Applications of power electronics in wind and solar energy</title>
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